AC - COPPER 200 PROCESS

Highly efficent acid copper plating process with excellent leveller and throwing properties.

Operating Condition :

• Copper sulphate        200 to 225 g/l
• Sulphuric acid           35 to 45ml/lit
• AC-COPPER 200 A      0.6 TO 0.8 ml/lit
• AC-COPPER 200 B      0.4 TO 0.6 ml/lit
• AC-COPPER 200 MU      9.0 TO 10.0 ml/lit
• Chloride content         <100PPM
• Temp.                        Room temperature
• Voltage                     3  to 5 volt
• annodes                 Phosphorised copper 
• air agitation  required
• continious filteration required